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Using the third dimension
IMEC has announced its intention to open a 3D-SOC design program. Using the third dimension is a promising way to improve integration. Details...
ITU includes WiMax in IMT - 2000 wireless suite
ITU includes WiMax in suite of 3G standards Details...
600 - W high - temp clamping diode housed in SMA package
STMicroelectronics announced the SMA6J series of 600-W peak-pulse-power clamping diodes, capable of operating at a junction temperature of 175 degrees C. Details...
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