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ST breaks ground on China back - end plant
STMicroelectronics this week broke ground on the site of its future chip packaging and test facility in Longgang, Guangdong Province, China. Details...
IBM - led alliance ups investment in 32nm packaging
The Common Platform alliance led by IBM plans to increase its investment in semiconductor packaging technology to pave the way to 32nm devices. Details...
AMD, Qimonda, Carl Zeiss unite in nanoanalysis
Advanced Micro Devices Inc., Qimonda AG and Carl Zeiss SMT are cooperating to bring future chip generations faster to volume production by improving characterization and metrology. Details...
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