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06 Mar 2007 - Freescale Redistributed Chip Packaging technology moves toward volume production
AUSTIN, Texas - March 6, 2007 - Freescale Semiconductor is setting up a pilot production line at its facility in Tempe, Ariz. for its recently announced Redistributed Chip Packaging (RCP) technology in preparation for volume manufacturing. In addition, the RCP technology hit a key milestone as it passed commercial industry specifications. Details... more »
AUSTIN, Texas - March 6, 2007 - Freescale Semiconductor is setting up a pilot production line at its facility in Tempe, Ariz. for its recently announced Redistributed Chip Packaging (RCP) technology in preparation for volume manufacturing. In addition, the RCP technology hit a key milestone as it passed commercial industry specifications. Details... more »
Intel to sample phase change memory in 1H 2007
Intel Corp. (Santa Clara, Calif.) is preparing to sample a 90-nm 128-Mbit phase change memory to customers in the first half of 2007. Mass production could begin before the end of 2007. Details... more »
Intel Corp. (Santa Clara, Calif.) is preparing to sample a 90-nm 128-Mbit phase change memory to customers in the first half of 2007. Mass production could begin before the end of 2007. Details... more »
Intel to sample phase change memory, successor to flash
Intel Corp. (Santa Clara, Calif.) is preparing to sample a 90-nm 128-Mbit phase change memory to customers in the first half of 2007. Mass production could begin before the end of 2007. Details... more »
Intel Corp. (Santa Clara, Calif.) is preparing to sample a 90-nm 128-Mbit phase change memory to customers in the first half of 2007. Mass production could begin before the end of 2007. Details... more »