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Big EDA firms not prepared to drive 3D integration, says panel

Big EDA firms not prepared to drive 3D integration, says panel
European research organization IMEC is putting a renewed emphasis on chip packaging, and on 3D-integration in particular, according to plans emerging at a press briefing ahead of its Annual Research Review Meeting. However, IMEC and European chip company experts are not expecting much help to come from the "big three" EDA companies.
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2007-10-18 12:57:00
 
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