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IM Flash delays production at Singapore plant
An IM Flash Technologies executive disclosed it will delay the start of production at its Singapore wafer fab by six months due to weak market conditions, according to <I>Reuters</I>. Details... more »
An IM Flash Technologies executive disclosed it will delay the start of production at its Singapore wafer fab by six months due to weak market conditions, according to <I>Reuters</I>. Details... more »
Incentive program levels Bluetooth field for small biz
The Bluetooth SIG has launched the Bluetooth Small Business Incentive Program designed to grow the Bluetooth technology market by creating new avenues of innovation and market entry for small businesses. Details... more »
The Bluetooth SIG has launched the Bluetooth Small Business Incentive Program designed to grow the Bluetooth technology market by creating new avenues of innovation and market entry for small businesses. Details... more »
TSMC, Intel, Samsung join hands on 450mm shift
Intel, Samsung and TSMC have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. Details... more »
Intel, Samsung and TSMC have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. Details... more »