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Japanese org targets DTV transition
A new organization in Japan hopes to achieve the goal of selling 30 million DTVs in the country by March 2008, or about 63 percent of its 48 million households. Details...
HeJian partners with Beijing IC Design Park on 0.18µm service
HeJian Technology (Suzhou) Co. Ltd will team up with Beijing IC Design Park to unveil multi-project wafer service. Details...
Chipbond to set up facilities for 12inch wafers
Chipbond Technology Corp. announced plans of setting up solder bumping facilities to process 10,000 to 12,000 units of 12inch wafers monthly. Details...
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