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At its developer conference 5b4 in Japan, Rambus Inc. is expected to demonstrate technologies that could enable links to memory chips delivering at up to a terabyte/second, showing a potentially lower cost alternative to 3D chip stacking. Details... more...

The XE900SL10-N enhanced RF transceiver from Xecom targets remote sensor networks by increasing the number of available network nodes, increasing data throughput, and providing additional communications options. Details... more...

How much math do you use in your job? Details... more...