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Under the Hood: When is a chip not a chip?
There are many reasons why a semiconductor component might be branded with markings that differ from those of its actual manufacturer. A case in point is the Apple iPhone, which includes multiple devices from large companies (such as Broadcom, Philips, Samsung and Texas Instruments); all the devices carry Apple package markings. Details... more »
There are many reasons why a semiconductor component might be branded with markings that differ from those of its actual manufacturer. A case in point is the Apple iPhone, which includes multiple devices from large companies (such as Broadcom, Philips, Samsung and Texas Instruments); all the devices carry Apple package markings. Details... more »
Hot products debut at Mobile World Congress
The 2008 GSMA Mobile World Congress kicked off in Barcelona, Spain this week featuring the latest in technology, services and developments aimed at advancing mobile broadband worldwide. Details... more »
The 2008 GSMA Mobile World Congress kicked off in Barcelona, Spain this week featuring the latest in technology, services and developments aimed at advancing mobile broadband worldwide. Details... more »
NI buys virtual instrumentation solutions provider
NI has acquired all of the outstanding shares of microLEX Systems A/S, a provider of virtual instrumentation-based video, audio and mixed-signal test solutions. Details... more »
NI has acquired all of the outstanding shares of microLEX Systems A/S, a provider of virtual instrumentation-based video, audio and mixed-signal test solutions. Details... more »