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Industrial affiliation program tackles 32nm IC packaging
Two research centers are inviting industry partners to participate in an advanced research program on next-generation flip-chip and substrate technologies. Details... more »
Two research centers are inviting industry partners to participate in an advanced research program on next-generation flip-chip and substrate technologies. Details... more »
U.S. tech groups split over green card proposals
New proposals to re-examine the status of foreign-born tech professionals are beginning to splinter American tech lobbying groups that had traditionally been on the same immigration policy page. Details... more »
New proposals to re-examine the status of foreign-born tech professionals are beginning to splinter American tech lobbying groups that had traditionally been on the same immigration policy page. Details... more »
Freescale, Continental co - develop 3 - core MCU for car brakes
Freescale and Continental have joined forces to design a high-performance, triple-core MCU optimized for electronic brake system applications. Details... more »
Freescale and Continental have joined forces to design a high-performance, triple-core MCU optimized for electronic brake system applications. Details... more »