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Singapore inventor gets patent for flip - chip IC assembly tech
Teck Kheng Lee of Singapore has been granted U.S. patent for his development of a method for assembling a flip chip semiconductor device. Details... more »
Teck Kheng Lee of Singapore has been granted U.S. patent for his development of a method for assembling a flip chip semiconductor device. Details... more »
PXI accessory attaches to any NI eight - slot PXI or PXI Express chassis
National Instruments has introduced the PMA-1115 portable touch-screen monitor with integrated keyboard that attaches to any NI eight-slot PXI or PXI Express chassis. Details... more »
National Instruments has introduced the PMA-1115 portable touch-screen monitor with integrated keyboard that attaches to any NI eight-slot PXI or PXI Express chassis. Details... more »
Tyco rolls Impact backplane connector system
Tyco Electronics has 5b4 released the high-speed, high-density Impact backplane connector system with 20+ Gbits/s performance. Details... more »
Tyco Electronics has 5b4 released the high-speed, high-density Impact backplane connector system with 20+ Gbits/s performance. Details... more »