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IBM, Cabot to devise CMP technology
Cabot Microelectronics Corp. has entered into an agreement with IBM Corp. to jointly develop chemical mechanical planarization (CMP) technology for 5b4 next-generation chips. Details...
Radial - leaded inductors target high - current circuit apps
The DR371-1 and DR371-2 series of radial-leaded, molded inductors from Datatronic Distribution are designed for high-current circuit applications. Details...
High - power RF module handles ZigBee
Radiocrafts has expanded its product line with a compact high-power RF module design for ZigBee. Details...
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